Lámina de PI (poliimida)
◆High temperature resistant
◆Abrasion resistant
◆Anti-deformation
◆Electrical insulation
◆Plasma, radiation
◆Ultra-low outgassing volume in vacuum
◆Excellent machining performance
◆Chemical resistance, resistant to grease, oil and solvents
It is now widely used in automobiles, semiconductors, office equipment, electronic and electrical equipment, scientific instruments, hot runners, petrochemical equipment, general machinery, textile machinery, laser printing, medical equipment and other fields.
◆Mould hot runner insulation board, insulation ring | ◆Piston ring, valve seat |
◆Chip test box | ◆Copier Separation Claw |
◆Laser embossing roller | ◆Semiconductor chip nozzle |
◆Semiconductor industry fixtures | Gas chromatography sealing ring |
◆Rolling, sliding and thrust washers | ◆Plasma cutting torch swirl ring |
Gear | ◆Automobile engine gasket |
◆Glass industry bracket | ◆Microwave parts |
Test items | Testing standards | unit | JHPI-10 | JHPI-20 | JHPI-30 | YS-20 | JHTPI |
density | GB/T 1033 | g/cm3 | 1.41 | 1.38 | 1.40-1.45 | 1.35-1.4 | 1.38 |
Tensile Strength | GB/T 1040 | Mpa | ≧80 | ≧130 | ≧40 | ≧130 | ≧85 |
Elongation at break | GB/T 1040 | % | ≧7.0 | ≧8.0 | ≧3.5 | ≧7.0 | ≧7.0 |
Bending Strength | GB/T 9341 | Mpa | ≧100 | ≧180 | —— | ≧131 | ≧110 |
Compression strength | GB/T 1041 | Mpa | ≧110 | ≧160 | ≧150 | ≧150 | ≧110 |
Impact strength | GB/T 1043 | kj/㎡ | 40 | ≧150 | ≧12 | ≧170 | NB |
Glass transition temperature | GB/T 19466 | ℃ | —— | 364 | 330 | —— | 230℃ |
Heat Deflection Temperature | GB/T 1643 | ℃ | 350 | 340 | —— | 239 | 250℃ |
Dielectric constant |