Placa JHPI-20

High temperature resistant polyimide super engineering plastics have many excellent properties that other engineering plastics do not have: high temperature resistance, low temperature resistance, corrosion resistance, self-lubrication, low wear, excellent mechanical properties, good dimensional stability, small thermal expansion coefficient, high insulation, low thermal conductivity, no melting, no rust, can replace metals, ceramics, polytetrafluoroethylene and engineering plastics in many cases, and are widely used in petrochemical, mining machinery, precision machinery, automobile industry, microelectronic equipment, medical equipment and other fields, with a good performance-price ratio. Widely used in aviation, aerospace, microelectronics, nano, liquid crystal, separation membrane, laser and other fields.

Parts with low friction coefficient and wear resistance under high speed and high pressure

Components with excellent resistance to creep or plastic deformation

Parts with excellent self-lubricating or oil-lubricating performance

Liquid sealing components under high temperature and high pressure

Components with high bending, stretching and impact resistance

Corrosion-resistant, radiation-resistant, and rust-resistant components

Parts that are used at temperatures exceeding 300°C for a long period of time or 400~450°C for a short period of time

Typical applications include:

(1) Parts with low friction coefficient and wear resistance under high speed and high pressure;

(2) Parts with excellent resistance to creep or plastic deformation;

(3) Parts with excellent self-lubricating or oil-lubricating properties;

(4) Liquid sealing components under high temperature and high pressure;

(5) Components with high bending, tensile and impact resistance;

(6) Corrosion-resistant, radiation-resistant and rust-resistant parts;

(7) Parts with long-term use temperature exceeding 300°C and short-term use temperature reaching 400~450°C;

(8) High temperature resistant (over 260°C) structural adhesives (modified epoxy resins, modified phenolic resins, modified organic silicone adhesives, etc. where the temperature resistance does not exceed 260°C);

(9) For microelectronic packaging, stress buffer protective coating, interlayer insulation of multi-layer interconnect structures, dielectric films, chip surface passivation, etc.